dkedr 31 Posted March 29, 2012 Share Posted March 29, 2012 Just though I'd let you guys know the results of my little experiment. This is my first time reflow soldering so I wasn't sure what to expect. I was told to use the frying pan, but that seemed a little wasteful, heating a chunk of steel, several KGs in weigh. So I decided to try something different. The part I soldered is a msp430g2231 in a QFN package, and as far as I can see all pins are fine and no solder jumps. I've programmed the chip to invert all pins, using the WDT interrupt every 32ms, I've measured the output with a bus pirate, which gives me 14hz and 15hz, so I'm assuming the chip held up alright. I realize this is only one peripherals, but I think it's the most temperature damageable one. Now I understand that to do reflowing properly, you have to follow certain rules about temperature increase and decrease gradients, but it's fairly difficult to control the temperature when using a gas flame. I did burn of some solder mask. What I had to start with was a board with a QFN foot print on it, and the ground pad was plated through to the underside ground plane. I applied the heat from ~5cm below the vias at the ground pad. The solder paste liquified in under 10 seconds. I just though I'd share a quick and dirty way to do some reflow. Solder paste has lead content. Butane lighter was just a generic china made one. If any one knows of a better way to test if the part is damaged please tell me. Quote Link to post Share on other sites
Join the conversation
You can post now and register later. If you have an account, sign in now to post with your account.