Dale 0 Posted February 7 Hi all, what are the best practices for conditioning signals coming onto (or leaving) an interface board? I'm interfacing an MSP432 LaunchPad to two sensor boards through two 2x6 pin-headers (two of the four I2C ports on each connector, and all four high-drive GPIO). An SPI port is available for a master/slave launchpad configuration (one master with up to three slaves), and two normal GPIO as well - just in case. A colleague recommended a "100 ohm" ferrite beads with a 100pF bypass cap and a 5V TVS to ground on each signal. I want the board to be solderable by hand, the ferrite beads are big enough being 1210s, and I picked 0805 bypass caps. However, the TVS recommended was a 1201 and the biggest chip TVS I could find was a 12V in an 0603 package. Does that seem right? Will as 12V part be a waste of time? What would you recommend? Also I'm curious about the orientation of the parts relative to each other for best routing. Can anyone share some insights? Many thanks, Dale booster-i2c-schematic-008-X04.pdf bom-pv-008-X04.pdf Share this post Link to post Share on other sites
jazz 207 Posted February 9 Unfortunately, this things must be analyzed with scope and on board modification until (almost) perfect signal shape is found. https://electronics.stackexchange.com/questions/33372/spi-bus-termination-considerations 1 Dale reacted to this Share this post Link to post Share on other sites
