I am working on a breakout / test board for a TLC5940 that I got in one of those HTSSOP-28 packages, with the little metal back that you're supposed to attach to a copper area using thermal vias and use as heat sink.
My question is: is there a way for me to "hand solder" that part without reflowing the board? Will it work if I try to heat it from the back of the board with a soldering iron, or is the copper area too large and it will never heat up to a point where the solder melts? Would some flux maybe help?
Should I just wack some thermal paste between board and component and not even