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Showing results for tags 'HTSSOP'.
I am working on a breakout / test board for a TLC5940 that I got in one of those HTSSOP-28 packages, with the little metal back that you're supposed to attach to a copper area using thermal vias and use as heat sink. My question is: is there a way for me to "hand solder" that part without reflowing the board? Will it work if I try to heat it from the back of the board with a soldering iron, or is the copper area too large and it will never heat up to a point where the solder melts? Would some flux maybe help? Should I just wack some thermal paste between board and component and not even