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About NickO1426471349

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  1. The hardware on the BoosterPack will not be able to support such high currents (connectors/sense resistors/traces/etc). Due to the size/cost/thermal limitations we are looking at it is simply not possible to support that much power. I would have to send you in the direction of this EVM http://www.ti.com/tool/drv8302-hc-c2-kit for that kind of hardware. I'm sure you could a find a way to put different FETs on the BoosterPack but the results would be unpredictable. Regards, Nick
  2. Point taken Tom, I will make a note to look into this. Thanks. Nick
  3. Chris said it, one driver per board. Simply not the room for two while maintaining the BoosterPack theme. Also as Tom said, thermal dissipation would be difficult. @Tom Don't know anything myself but I'll ask around. I have found the best reference for hardware designs to actually be the DRV830X EVM in control suite under development kits.
  4. Howdy, I am a Texas A&M Aggie that has been working as an intern in motor drive at Texas Instruments the last few summers. I have done a few projects with the MSP430 LaunchPad and pumped to see that they are expanding the series. Nick
  5. Yes, I haven't registered as a TI employee on here yet but saw the post and thought I would chip in. If anyone has any suggestions/features they would like to see, feel free to chime in and I can pass the ideas along. Nick
  6. The one currently in progress at TI is based upon the DRV8301/2 and will utilize Texas Instrument's NexFETs.
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